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Texas Components

Corporation

 

 

COMPANY PROFILE

 

 

Texas Components Corporation is a technologically advanced

manufacturing and engineering services business located in

Houston Texas.

 

Since 1980, Texas Components Corporation has specialized in

advanced engineering and manufacturing processes that include

Vishay Bulk Metal¨ foil resistive products, custom

microelectronic assemblies, and systems integration that tie all of

our technologies together.

 

The following products and services are available to you:

 

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PRECISION RESISTIVE PRODUCTS

_ MICROELECTRONIC PRODUCTS

Thank you for your interest in Texas Components Corporation and

we look forward to working with you in the future. If you require

any additional informationÓ or have any questions, please feel free

to give us a call.

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

MICROELECTRONICS

PRODUCTS

DIVISION

 

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

Microelectronics Design, Integration,

&

Packaging

 

 

Texas Components Corporation applies innovative approaches to

provide microelectronic designs and integration and packaging

services that are ideal for R&D projects. We excel at one-of-a-kind

designs, accelerated development projects and small to medium

quantity production runs.

 

At Texas Components, you have a variety of packaging options for

your design which include but not (.limited to ceramic, metal,

plastic packages (DIP, CLCC, PLCC, CPGA, MCM, PGA, ETC.),

or Chip-On-Board. Virtually any package size and shape can be

utilized.

 

In all assembly processes, proven techniques are used to provide a

viable solution with four distinct advantages:

 

¥

NO Minimum Quantity Requirements

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NO N.R.E. Charges

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Accelerated Development and Production.

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NO Redesign Tooling Charges

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

Texas Components Corporation can offer creative solutions for a

variety of applications. Our concepts are applicable to a wide range

of circuit designs. Designs are limited only by package and die

availability, die size, power dissipation requirements, and layout

restrictions.

 

The design and/or implementation of high performance

analog and mixed technology circuits are among our

specialties!

 

 

Microprocessor Multi-Chip-Modules

 

Memories, Communications, Amplifiers

 

Converters, A/D, D/A

 

Regulators, Gate Arrays,

 

Analog Multiplexers

 

...Etc...

 

Because Texas Components is an authorized Vishay Precision

Center for Bulk Metal¨ foil resistive components, it has the in

house ability to incorporate precision resistors with better than

5ppm TCR, with accuracy's to 0.002%, and ratio tracking to 2ppm/

¼C, within itÕs microelectronic designs.

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

Common Myths about Microelectronic Assemblies

 

 

Myth: Microelectronic assemblies are very expensive.

 

Over the past several years, improvements in manufacturing

technology (materials, equipment and processes) have substantially

reduced costs, making microelectronic pricing more attractive.

When performance, space limitations, shock and vibration,

reliability and reworkability are significant design factors,

microelectronic assemblies can be more cost effective than the

conventional surface mount or through hole approach.

 

Myth: Microelectronic assemblies are unreliable.

 

Unlike plastic encapsulated devices, microelectronic circuits are

hermetically sealed in dry nitrogen, which significantly reduces the

effects of two major problems that affect plastic components at

higher temperatures:

 

1. CTE (coefficients of thermal expansion) mismatches between

wire/plastic and silicon/plastic are magnified during component

soldering and exposure to high temperatures. Microelectronic wire

bonds are not physically distorted with temperature changes, thus

reducing induced mechanical stresses on the bond pad interfaces.

2. At elevated temperatures, many plastic encapsulants will outgas

ionic contaminants that degrade the wire bondsÕ reliability.

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

It is also known that both FR4 and Polyimide printed circuit boards

can experience delamination at higher operating temperatures.

Ceramic substrates do not experience such effects, having been

fired at 850¼C or more.

 

Texas Components Corporation's microelectronic products are

subjected to extensive screening procedures during manufacturing.

It is important to note that this screening is merely a method of

process verification. The materials selected and our advanced

manufacturing processes are responsible for superior reliability.

Reliability is not "screened in" but rather, is engineered into the

product.

 

Myth: Microelectronic assemblies are unrepairable.

 

Texas Components Corporation can de-lid and repair or modify

microelectronic products. Damaged assemblies or those needing

revision changes need not be discarded. Microelectronic products

can normally be reworked to meet their original or updated

specifications.

 

Texas Components Corporation provides a two-year warranty

against defects in materials and workmanship on all

Microelectronic products.

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

DIE LEVEL PROGRAMMING

 

 

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Programmable Gate Arrays (PGA)

_ EPROM

¥

EEPROM

¥

FLASH

Texas Components Corporation has the ability to program PGA's

and most memory devices at the die level, before insertion into the

package. This procedure provides the distinct advantage of

reducing the total pin count to power and I/O only. The die's

programming pins need not be connected to the package itself

unless your design specifically requires them. PGA and memory

die can be placed in various package pin counts dependent upon

die size and I/O width. These die may be packaged in a monolithic

configuration or incorporated with other die as part of a true

microelectronic circuit.

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

DEVICE EMULATION

 

 

Texas Components Corporation has provided solutions for

customers faced with board or system redesigns due to a

discontinued semiconductor component. In most cases, a single

PGA can be used to emulate the discontinued component and then

packaged as a direct plug in replacement. For high density and

mixed signal components, PGA's in unification with additional

support circuitry can be utilized to provide a solution that requires

no redesign.

 

MICROELECTRONIC REPAIR

&

MODIFICATION

 

 

Microelectronics that have failed or need modification need not

always be discarded. Texas Components Corporation can precisely

de-lid many sealed packages, repair or modify the existing circuit,

and reseal the package to meet the original mechanical and

electrical specifications.

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

ELECTRICAL TEST & SCREENING

 

STANDARD

 

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Environmental Electrical Testing From -65¡C to 200¡C

All microelectronic designs can be manufactured and tested at

commercial, industrial, and military temperature ranges.

 

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Device Burn-In

Static or dynamic device burn-in is accomplished following MILSTD 883 procedures.

 

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Full Device Screening

Complete MIL Standard Screening Procedures for microelectronics

are employed for each device produced.

 

CUSTOMER SPECIFIED

 

Texas Components will adhere to your electrical test and screening

specifications. If asked, Texas Components Corporation will offer

suggested testing protocols.

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

ENGINEERING SERVICES

 

 

At Texas Components Corporation, Our engineering staff is

available to assist you throughout the entire design cycle from

conception to completion. Our engineering services include:

 

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Conceptual Design Discussions

Texas Components Corporation encourages pre-design conceptual

discussions with our customers. Our microelectronics experience

allows us to offer insights and pre-design suggestions.

 

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Design Assistance

Texas Components Corporation stands ready to assist you in your

microelectronic design concerns including die availability,

environmental performance of various die manufacturers, and

manufacturing issues involving the implementation of your circuit

design into a microelectronic assembly.

 

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Complete Turn-Key Engineering Solutions

Provide us with your functional and environmental specifications and

our engineers will evaluate, design, and produce a microelectronic

product that meets your requirements. This includes new products,

redesigns, and replacements for discontinued semiconductor

components.

 

Resistive Products Division

1716 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 468-3882 Fax (713) 461-2098

 

 

Microelectronic Products Division

1662 West Sam Houston Parkway North, Houston Texas 77043

Phone (713) 365-9199 Fax (713) 973-2838

 

 

www texascomponents com

 

 


 

Texas Components

Corporation

 

 

HIGH TEMPERATURE CAPACITOR MODULES

 

 

Texas Components Corporation manufactures custom high

temperature (200¡C) capacitor modules as a superior alternative or

replacement for wet slug tantalum capacitors. These devices can be

manufactured in nearly any configuration of value, shape, size and

voltage to be defined by the customer's requirements.

 

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Designed using ceramic chip capacitors (which have no acidic liquid

core to damage circuit board assemblies, as do wet tantalum

capacitors)

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X7R temperature specifications

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Solderless construction for high mechanical reliability

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